Main R&D Areas：

Package system design and simulation, testing technology

Wafer-level packaging technology and assembly technology

Packaging substrate technology

Contact Info：

Kelaiti XIAO

0510-66679379

kexiao@ncap-cn.com

http://www.ncap-cn.com/contact/

Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Wuxi, Jiangsu Province

半导体所大楼东侧

半导体所大楼南侧正门

半导体所实验室